Sources and Solutions for
Laser Marking Applications in the Semiconductor Industry
ROFIN offers the most comprehensive product line worldwide for the semiconductor industry. The portfolio ranges from laser sources to turnkey solutions for micro and marking applications such as IC and wafer marking, LED marking, lead-frame marking, cutting and IC decapping.
At ROFIN you will find comprehensive knowledge of all aspects related to the various laser applications in semiconductor manufacturing. Working closely with our customers and partners, we have established considerable expertise in customer-specific solutions.
Click here for more information on ROFIN's Semiconductor products.
WaferlaseŽ line of Wafer Marking Systems
Waferlase systems are designed to meet the most stringent requirements of silicon wafer marking assuring traceability of the manufacturing process for fault analysis of semiconductor devices. The systems all produce marks that are machine-readable, have no negative influence on subsequent manufacturing steps, and still permit clear identification at the end of the process chain.
WaferlaseŽ
ID 200
Small footprint, open cassette wafer ID system produces debris-free marks on wafers up to 200mm in size.
WaferlaseŽ ID LED
Open-cassette III-IV LED wafer ID marking system, designed to meet the most stringent requirements of transparent and semi-transparent wafer marking.
WaferlaseŽ
Ultra
Debris-free marking on polished silicon wafers for the device manufacturer.
WaferlaseŽ Performance
Deep marking (hard mark) of silicon wafers prior to final polish.
Download
(166 KB)
Brochure:
Waferlase ID 200
(221 KB)
Brochure: Waferlase ID LED
(132 KB)
Brochure: Waferlase Ultra
